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CM1424 MultiMedia Card EMI Filter Array with ESD Protection
Features
* * * * * * * * * * Three channels of EMI filtering, each with ESD protection Two channels of ESD protection Flow-through routing for MMC interface 15kV ESD protection (IEC 61000-4-2, contact discharge) 30kV ESD protection (HBM) Greater than 30dB of attenuation at 1GHz Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 10-bump, 1.998mm x 1.458mm footprint Chip Scale Package (CSP) Available with OptiGuardTM coating for improved reliability Lead-free version available
Product Description
The CM1424 is an EMI filter array integrating 3 pi-filters (C-R-C) and 2 channels of ESD protection. The CM1424 has component values of 12pF - 100 - 12pF. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of 15kV, beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MILSTD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than 30kV. The ESD diodes on pins A2 and C2 safely dissipate ESD strikes of 15kV, well beyond the maximum requirement of the IEC 61000-4-2 international standard. This device is particularly well-suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package and easy-to-use pin assignments. In particular, the CM1424 is ideal for EMI filtering and protecting data lines from ESD for the MultiMedia Card (MMC) slot in mobile handsets. The CM1424 devices are optionally available with OptiGuardTM coating which results in improved reliability. The CM1424 is available in space-saving, low-profile, chip-scale packages with optional lead-free finishing.
Applications
* * * MultiMedia Card (MMC) slot in mobile handsets and other handheld devices such as digital cameras and MP3 players I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers
Electrical Schematic
EMI Filter + ESD Channel 1 CMD A1 100 C1 CMD ESD Channel 1 A2 ESD Channel 2 C2
12pF
12pF
EMI Filter + ESD Channel 2 CLK A3 100 C3 CLK DAT0 A4
EMI Filter + ESD Channel 3 100 C4 DAT0
12pF
12pF
(c) 2005 California Micro Devices Corp. All rights reserved. 09/16/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
12pF
12pF
www.cmd.com
1
CM1424
PACKAGE / PINOUT DIAGRAMS (Bumps Down View) 1 2 3 4
A B C
TOP VIEW
BOTTOM VIEW
(Bumps Up View)
EMI+ESD3 EMI+ESD2 ESD1
A4
A3 B2
GND
A2
GND
A1
EMI+ESD1
N241
C4
B1 C1
EMI+ESD1
C3
EMI+ESD2
C2
ESD2
EMI+ESD3
CM1424 CSP Package (Uncoated)
(Bumps Down View)
Orientation Marking (see note 2)
TOP VIEW
2 3 4
BOTTOM VIEW
(Bumps Up View)
EMI+ESD3 EMI+ESD2 ESD1
1 A B C
A4
A3 B2
GND
A2
GND
A1
EMI+ESD1
N243
C4
B1 C1
EMI+ESD1
C3
EMI+ESD2
C2
ESD2
EMI+ESD3
Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
CM1424 CSP Package (OptiGuardTM coated)
PIN DESCRIPTIONS
PIN(s) A1 A2 A3 A4 B1-B2 NAME EMI+ESD1 ESD1 EMI+ESD2 EMI+ESD3 GND DESCRIPTION CMD Filter Channel 1 ESD Channel 1 CLK Filter Channel 2 DAT0 Filter Channel 3 Device Ground PIN(s) C1 C2 C3 C4 NAME EMI+ESD1 ESD2 EMI+ESD2 EMI+ESD3 DESCRIPTION CMD Filter Channel 1 ESD Channel 2 CLK Filter Channel 2 DAT0 Filter Channel 3
Ordering Information
PART NUMBERING INFORMATION
Standard Finish No Coating Ordering Part Bumps 10 PKG CSP Number1 CM1424-01CS Part Marking N241 OptiGuardTM Coated Ordering Part Number1 CM1424-03CS Part Marking N243 Lead-free Finish2 No Coating Ordering Part Number1 CM1424-01CP Part Marking N241 OptiGuardTM Coated Ordering Part Number1 CM1424-03CP Part Marking N243
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
(c) 2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
A1
Orientation Marking (see note 2)
Orientation Marking
Orientation Marking
A1
09/16/05
CM1424
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 300 UNITS C mW mW
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL R C VDIODE ILEAK VSIG PARAMETER Resistance Capacitance Diode Standoff Voltage Diode Leakage Current (reverse bias) Signal Clamp Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Dynamic Resistance Positive Negative Cut-off Frequency ZSOURCE=50, ZLOAD=50 Channel R=100, Channel C=12pF At 2.5V DC, 1MHz, 30mV AC IDIODE = 10A VDIODE = +3.3V ILOAD = 10mA 5.6 -1.5 30 15 CONDITIONS MIN 80 9 TYP 100 12 6.0 100 6.8 -0.8 300 9.0 -0.4 MAX 120 15 UNITS pF V nA V V kV kV
VESD
Notes 2 and 3
RDYN
1.6 0.4 157
MHz
fC
Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: These parameters are guaranteed by design and characterization.
(c) 2005 California Micro Devices Corp. All rights reserved. 09/16/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
3
CM1424
Performance Information
Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B1)
Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2)
(c) 2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
09/16/05
CM1424
Performance Information (cont'd)
Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss VS. Frequency (A4-C4 to GND B2)
Figure 4. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25C)
(c) 2005 California Micro Devices Corp. All rights reserved. 09/16/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
5
CM1424
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Maximum Soldering Temperature for a Eutectic Device using Eutectic Solder Paste Maximum Soldering Temperature for a Lead-free Device using Lead-free Solder Paste VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125mm - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 240C 260C
Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA.
Figure 5. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (C)
200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0
Figure 6. Eutectic (SnPb) Solder Ball Reflow Profile
(c) 2005 California Micro Devices Corp. All rights reserved.
Figure 7. Lead-free (SnAgCu) Solder Ball Reflow Profile
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
09/16/05
CM1424
Mechanical Details (cont'd)
CM1424 devices are supplied in custom Chip Scale Packages (CSP) and are available with optional OptiGuardTM coating. CM1424 Mechanical Specifications The package dimensions for the CM1424 are presented below.
B2 B1
Mechanical Package Diagrams Non-coated CSP
BOTTOM VIEW
A1 C1 B4 B3
SIDE VIEW
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2
1 1
C B A 1
Max
A2
Custom CSP 10 Millimeters Inches Min Nom Nom Max
2
3
4
C2
Min
1.953 1.998 2.043 0.0769 0.0787 0.0804 1.413 1.458 1.503 0.0556 0.0574 0.0592 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.199 0.249 0.299 0.0078 0.0098 0.0118 0.244 0.294 0.344 0.0096 0.0116 0.0135 0.562 0.606 0.650 0.0221 0.0239 0.0256 0.356 0.381 0.406 0.0140 0.0150 0.0160 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces
0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
D1 D2
OptiGuardTM Coated CSP
BOTTOM VIEW
A1 B2 B1 C1 B4 B3
OptiGuardTM Coating
C B A 1 2 3 4
C2 D3 D4 A2
D32 D42
# per tape and reel
Controlling dimension: millimeters
Note 1: Applies to uncoated devices only. Note 2: Applies to OptiGuardTM (coated) devices only.
0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
SIDE VIEW
DIMENSIONS IN MILLIMETERS Package Dimensions for CM1424 Chip Scale Package
(c) 2005 California Micro Devices Corp. All rights reserved. 09/16/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
7
CM1424
Mechanical Details (cont'd)
CSP Tape and Reel Specifications
PART NUMBER CM1424-01 CM1424-03 CHIP SIZE (mm) 1.998x 1.458 x 0.606 1.998 x 1.458 x 0.644 POCKET SIZE (mm) B0 X A0 X K0 2.29 x 1.6 x 0.81 2.29 x 1.6 x 0.81 TAPE WIDTH W 8mm 8mm REEL DIAMETER 178mm (7") 178mm (7")
10 Pitches Cumulative Tolerance On Tape 0.2 mm
QTY PER REEL 3500 3500
P0 4mm 4mm
P1 4mm 4mm
Po Top Cover Tape
Ao W Bo
Ko
For Tape Feeder Reference Only including Draft. Concentric Around B.
Embossment
P1 User Direction of Feed
Center Lines of Cavity
Figure 8. Tape and Reel Mechanical Data
(c) 2005 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
09/16/05

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